Package Dimensions(mm):

Key Features:
• 99.99% gold wire bonding, 12mil
• Red copper Subtrate
• Chips: 300pcs* 45mil Epileds Chips
• Connections: 20 in series, 15 in parallel (The chips layout is customizable)
• Applications: Agricultural lighting, horicultural lighting and other professional or commercial lighting.
Descriptions:
Power: 300W
Type: Oval Base
Wavelength: 430nm +-5nm
Beam Angle: 140deg.
Voltage: 60-65V Current: 5250mA
Radiant Power: 40000-45000mW
Extra HEATSINK equipment is required for the LED.
Spectral Power Distribution:


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