Package Dimensions(mm):
(Square Substrate)
(Oval Substrate)
Key Features:
• 99.99% gold wire bonding, 1.2mil
• Red copper Subtrate
• Chips: 20pcs* 45mil Epileds Chips
• Chips Connections: 10 in series, 2 in parallel (the chips connection could be customized)
• Substrate Type: Square and Oval (The active lighting area is the same, only the shape is different)
• Applications: Health Care, 3D Printing, UV Curing and other professional lightings or instrument.
Absolute Maximum Ratings at Ta=25℃
Item |
Symbol |
Absolute Maximum Rating |
Unit |
DC Forward Current |
IF |
700 |
mA |
Peak Forward Current |
IF |
1000 |
mA |
Reverse Voltage |
VR |
5 |
V |
Power Dissipation |
PD |
20 |
W |
Electrostatic discharge |
ESD |
±4500 |
V |
Operation Temperature |
Topr |
-40~+80 |
℃ |
Storage Temperature |
Tstg |
-40~+100 |
℃ |
Lead Soldering Temperature |
Tsol |
Max.260℃ for 6 seconds Max. |
|
Life test |
---- |
1000 H Luminous intensity weaken< 5%(700mA,Ta=65℃); 50,000 H Luminous intensity weaken < 20% (700mA,Ta=65℃); |
Electrical Optical Characteristics at Ta=25℃
Parameter |
Symbol |
Min. |
Typ. |
Max. |
Unit |
Test Condition |
Forward Voltage |
VF |
30.0 |
34.0 |
36.0 |
V |
IF=700mA |
Reverse Current |
IR |
--- |
--- |
50 |
uA |
VR=5V |
50% Power Angle |
2θ1/2 |
--- |
140 |
--- |
Deg. |
IF=700mA |
Radiant Power |
Po |
4000 |
--- |
6000 |
mW |
IF=700mA |
Peak Wavelength |
λp |
--- |
365 |
370 |
nm |
IF=700mA |
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