Package Dimensions(mm):
Square Substrate
Oval Substrate
Key Features:
• 99.99% gold wire bonding, 1.2mil
• Red copper Subtrate
• Epileds, 30pcs *45mil Chips
• Chips Layout: 10 in series, 3 in parallel (The layout could be customized)
• Applications: • UV gluing and marking; • UV curing of inks and varnishes; • Fluorescent minerals and gems inspection.
Absolute Maximum Ratings at Ta=25℃
Item |
Symbol |
Absolute Maximum Rating |
Unit |
DC Forward Current |
IF |
1050 |
mA |
Peak Forward Current |
IF |
1200 |
mA |
Reverse Voltage |
VR |
5 |
V |
Power Dissipation |
PD |
30 |
W |
Electrostatic discharge |
ESD |
±4500 |
V |
Operation Temperature |
Topr |
-40~+80 |
℃ |
Storage Temperature |
Tstg |
-40~+100 |
℃ |
Lead Soldering Temperature |
Tsol |
Max.260℃ for 6 seconds Max. |
|
Life test |
---- |
1000H Luminous intensity weaken< 5%(1050mA,Ta=65℃); 50,000H Luminous intensity weaken < 20%(1050mA,Ta=65℃); |
Electrical Optical Characteristics at Ta=25℃
Parameter Symbol Min. Typ. Max. Unit Test Condition Forward Voltage VF 30.0 --- 36.0 V If=1050mA Reverse Current IR --- --- 50 uA VR=5V 50% Power Angle 2θ1/2 --- 140 --- Deg. IF=1050mA Radiant Power Po 8000 --- 10000 mW IF=1050mA Peak Wavelength λp 380 385 nm IF=1050mA
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