Package Dimension(mm):
(Square Substrate)
(Round Substrate)
Absolute Maximum Ratings at Ta=25℃
Item |
Symbol |
Absolute Maximum Rating |
Unit |
DC Forward Current |
IF |
1050 |
mA |
Peak Forward Current |
IF |
1200 |
mA |
Reverse Voltage |
VR |
5 |
V |
Power Dissipation |
PD |
10 |
W |
Electrostatic discharge |
ESD |
±4500 |
V |
Operation Temperature |
Topr |
-40~+80 |
℃ |
Storage Temperature |
Tstg |
-40~+100 |
℃ |
Lead Soldering Temperature |
Tsol |
Max.260℃ for 6 seconds Max. |
|
Life test |
---- |
1000H Luminous intensity weaken< 5%(1050mA,Ta=65℃); 50,000H Luminous intensity weaken < 20% (1050mA,Ta=65℃); |
Electrical Optical Characteristics at Ta=25℃
Parameter |
Symbol |
Min. |
Typ. |
Max. |
Unit |
Test Condition |
Forward Voltage |
VF |
9.0 |
--- |
10.0 |
V |
If=1050mA |
Reverse Current |
IR |
--- |
--- |
50 |
uA |
VR=5V |
50% Power Angle |
2θ1/2 |
--- |
140 |
--- |
Deg. |
IF=1050mA |
Radiant Power |
Po |
3000 |
--- |
4000 |
mW |
IF=1050mA |
Peak Wavelength |
λp |
415 |
420 |
425 |
nm |
IF=1050mA |
Descriptions:
Power: 10W
Chips: 9pcs * 45mil Epileds
Substrate Type: Square and Round
Wavelength: 420nm +-5nm
Beam Angle: 140deg.
Voltage: 9.0-10.0V Current: 1050mA (3 in series, 3 in parallel)
Radiant Power: 3000-4000mW
Additional Heat-sink equipment is recommended when operation temperature is higher than 55 degrees.
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