Package Dimension(mm):

Key Features:
• 99.99% gold wire bonding, 1.5mil
• Red copper Subtrate
• Chips: 200pcs* 45mil Epileds Chips
• Connections: 20 in series, 10 in parallel. (The Chips layout is customizable)
• Applications: Agricultural lighting, horicultural lighting and other professional or commercial lighting.
Descriptions:
Power: 200W
Substrate Type: Oval
Wavelength: 440nm +-5nm
Beam Angle: 140deg.
Voltage: 60.0-64.0V Current: 3500mA
Radiant Power: 60000-80000mW
Additional Heatsink equipment is required for the LED.
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