Package Dimensions(mm):
Square Substrate
Oval Substrate
Key Features:
• 99.99% gold wire bonding, 1.2mil
• Red copper Subtrate
• Substrate Type: Oval and Square
• Chips: 100pcs* 42mil Chips
• Chips Connection: 10 in series, 10 in parallel (The chips layout is customizable)
• Applications: Agricultural and horicultural lighting
Absolute Maximum Ratings at Ta=25℃
Item |
Symbol |
Absolute Maximum Rating |
Unit |
DC Forward Current |
IF |
3500 |
mA |
Peak Forward Current |
IF |
4000 |
mA |
Reverse Voltage |
VR |
5 |
V |
Power Dissipation |
PD |
100 |
W |
Electrostatic discharge |
ESD |
±4500 |
V |
Operation Temperature |
Topr |
-40~+80 |
℃ |
Storage Temperature |
Tstg |
-40~+100 |
℃ |
Lead Soldering Temperature |
Tsol |
Max.260℃ for 6 seconds Max. |
|
Life test |
---- |
1000H Luminous intensity weaken< 5%(3500mA,Ta=65℃); 50,000H Luminous intensity weaken < 20% (3500mA,Ta=65℃); |
Electrical Optical Characteristics at Ta=25℃
Parameter |
Symbol |
Min. |
Typ. |
Max. |
Unit |
Test Condition |
Forward Voltage |
VF |
18.0 |
---- |
20.0 |
V |
If=3500mA |
Reverse Current |
IR |
--- |
--- |
50 |
uA |
VR=5V |
50% Power Angle |
2θ1/2 |
--- |
140 |
--- |
Deg. |
IF=3500mA |
Radiant Power |
Po |
10000 |
---- |
12000 |
mW |
IF=3500mA |
Peak Wavelength |
λp |
745 |
750 |
755 |
nm |
IF=3500mA |
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