Package Dimension(mm):

Square Substrate

Oval Substrate

Key Features:

• 99.99% gold wire bonding, 1.2mil

• Chips: 30pcs 42mil Epileds

• Substrate Type: Square and Oval

• Chips Connection: 10 in series, 3 in parallel (The chips layout is customizable)

• Applications: mainly used for Iris scanner, surveilance system, CCTV camera, night and machine vistion, medical and other professional equipment

• Extra HEATSINK is required for the LEDs.

Absolute Maximum Ratings at Ta=25?

Item	Symbol	Absolute Maximum Rating	Unit
DC Forward Current	IF	1050	mA
Peak Forward Current	IF	1200	mA
Reverse Voltage	VR	5	V
Power Dissipation	PD	30	W
Electrostatic discharge	ESD	±4500	V
Operation Temperature	Topr	-40~+80	?
Storage Temperature	Tstg	-40~+100	?
Lead Soldering Temperature	Tsol	Max.260? for 6 seconds Max.
Life test	----	1000 H Luminous intensity weaken< 5%(1050mA,Ta=65?); 50,000 H Luminous intensity weaken < 20% (1050mA,Ta=65?);

Electrical Optical Characteristics at Ta=25?

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Condition
Forward Voltage	VF	14.0	---	16.0	V	If=1050mA
Reverse Current	IR	---	---	50	uA	VR=5V
50% Power Angle	2θ1/2	---	140	---	Deg.	IF=1050mA
Radiant Power	Po	4000	---	5000	mW	IF=1050mA
Peak Wavelength	λp	805	810	---	nm	IF=1050mA