Package Dimension(mm):

Key Features:

• 99.99% gold wire bonding, 1.2mil

• Red copper Subtrate

• Chips: 4pcs* 45mil Epileds Chips, 2 in series, 2 in parallel

• Beam Angle: 60 degree and 120 degree are available

• Substrate Type: Emitters on Star PCB or only Emitters

• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.

• Extra HEATSINK is required for the LEDs.

Absolute Maximum Ratings at Ta=25?

Item	Symbol	Absolute Maximum Rating	Unit
DC Forward Current	IF	700	mA
Peak Forward Current	IF	1000	mA
Reverse Voltage	VR	5	V
Power Dissipation	PD	5000	mW
Electrostatic discharge	ESD	±4500	V
Operation Temperature	Topr	-40~+80	?
Storage Temperature	Tstg	-40~+100	?
Lead Soldering Temperature	Tsol	Max.260? for 6 seconds Max.
Life test	----	1000 H Luminous intensity weaken< 5%(700mA,Ta=65?);50,000 H Luminous intensity weaken < 20% (700mA,Ta=65?);

Electrical Optical Characteristics at Ta=25?

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Condition
Forward Voltage	VF	5.0	---	6.0	V	If=700mA
Reverse Current	IR	---	---	50	uA	VR=5V
50% Power Angle	2θ1/2	---	140	---	Deg.	IF=700mA
Luminous Flux	Φ	200	---	300	lm	IF=700mA
Peak Wavelength	λp	525	530	535	nm	IF=700mA

Package Dimension(mm):

Key Features:

• 99.99% gold wire bonding, 1.2mil

• Red copper Substrate

• Chips: 2pcs* 45mil Epileds Chips

• Type: Emitter on Star PCB or only the emitter

• Beam Angle: 60 degree and 120 degree are available

• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.

• Extra HEATSINK is required for the LEDs.

Absolute Maximum Ratings at Ta=25?

Item	Symbol	Absolute Maximum Rating	Unit
DC Forward Current	IF	700	mA
Peak Forward Current	IF	1000	mA
Reverse Voltage	VR	5	V
Power Dissipation	PD	3000	mW
Electrostatic discharge	ESD	±4500	V
Operation Temperature	Topr	-40~+80	?
Storage Temperature	Tstg	-40~+100	?
Lead Soldering Temperature	Tsol	Max.260? for 6 seconds Max.
Life test	----	1000 H Luminous intensity weaken< 5%(700mA,Ta=65?);50,000 H Luminous intensity weaken < 20% (700mA,Ta=65?);

Electrical Optical Characteristics at Ta=25?

Package Dimension(mm):

Absolute Maximum Ratings at Ta=25?

Item	Symbol	Absolute Maximum Rating	Unit
DC Forward Current	IF	350	mA
Peak Forward Current	IF	500	mA
Reverse Voltage	VR	5	V
Power Dissipation	PD	1000	mW
Electrostatic discharge	ESD	±4500	V
Operation Temperature	Topr	-40~+80	?
Storage Temperature	Tstg	-40~+100	?
Lead Soldering Temperature	Tsol	Max.260? for 6 seconds Max.
Life test	----	1000 H Luminous intensity weaken< 5%(350mA,Ta=65?);50,000 H Luminous intensity weaken < 20% (350mA,Ta=65?);

Electrical Optical Characteristics at Ta=25?

Package Dimension(mm):

Key Features:

• 99.99% gold wire bonding, 1.5mil

• Red copper Subtrate

• Chips: 300pcs* 45mil Epileds Chips (20 in series, 15 in parallel), the chips layout is customizable

• Substrate Type: Oval

• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.

• Extra HEATSINK is required for the LEDs.

Specifications:

Package Dimension(mm):

Key Features:

• 99.99% gold wire bonding, 1.5mil

• Red copper Substrate

• Chips: 200pcs* 45mil Epileds Chips (20 in series, 10 in parallel), the chips layout is customizable

• Substrate Type: Oval

• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.

• Extra HEATSINK is required for the LEDs.

Specifications:

Package Dimension(mm):

Square Substrate

Oval Substrate

Key Features:

• 99.99% gold wire bonding, 1.2mil

• Red copper Subtrate

• Chips: 100pcs* 45mil Epileds Chips (10 in series, 10 in parallel)

• Substrate Type: Oval and Square

• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.

• Extra HEATSINK is required for the LEDs.

Absolute Maximum Ratings at Ta=25?

Item	Symbol	Absolute Maximum Rating	Unit
DC Forward Current	IF	3500	mA
Peak Forward Current	IF	4000	mA
Reverse Voltage	VR	5	V
Power Dissipation	PD	100	W
Electrostatic discharge	ESD	±4500	V
Operation Temperature	Topr	-40~+80	?
Storage Temperature	Tstg	-40~+100	?
Lead Soldering Temperature	Tsol	Max.260? for 6 seconds Max.
Life test	----	1000 H Luminous intensity weaken< 5%(3500mA,Ta=65?); 50,000 H Luminous intensity weaken < 20% (3500mA,Ta=65?);

Electrical Optical Characteristics at Ta=25?

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Condition
Forward Voltage	VF	26.0	---	30.0	V	If=3500mA
Reverse Current	IR	---	---	50	uA	VR=5V
50% Power Angle	2θ1/2	---	140	---	Deg.	IF=3500mA
Luminous Flux	Φ	5000	---	6000	lm	IF=3500mA
Peak Wavelength	λp	525	530	535	nm	IF=3500mA

Package Dimension(mm):

Square Substrate

Oval Substrate

Key Features:

• 99.99% gold wire bonding, 1.2mil

• Red copper Substrate

• Chips: 50pcs* 45mil Epileds Chips (10 in series, 5 in parallel)

• Substrate Type: Oval and Square

• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.

• Extra HEATSINK is required for the LEDs.

Absolute Maximum Ratings at Ta=25?

Item	Symbol	Absolute Maximum Rating	Unit
DC Forward Current	IF	1750	mA
Peak Forward Current	IF	2000	mA
Reverse Voltage	VR	5	V
Power Dissipation	PD	50	W
Electrostatic discharge	ESD	±4500	V
Operation Temperature	Topr	-40~+80	?
Storage Temperature	Tstg	-40~+100	?
Lead Soldering Temperature	Tsol	Max.260? for 6 seconds Max.
Life test	----	1000 H Luminous intensity weaken< 5%(1750mA,Ta=65?); 50,000 H Luminous intensity weaken < 20% (1750mA,Ta=65?);

Electrical Optical Characteristics at Ta=25?

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Condition
Forward Voltage	VF	26.0	---	30.0	V	If=1750mA
Reverse Current	IR	---	---	50	uA	VR=5V
50% Power Angle	2θ1/2	---	140	---	Deg.	IF=1750mA
Luminous Flux	Φ	2500	---	3500	lm	IF=1750mA
Peak Wavelength	λp	525	530	535	nm	IF=1750mA

Package Dimensions(mm):

Square Substrate

Oval Substrate

Key Features:

• 99.99% gold wire bonding, 1.2mil

• Red copper Subtrate

• Chips: 30pcs* 45mil Epileds Chips, 10 in series, 3 in parallel. (The chips layout is customizable)

• Substrate Type: Oval and Square

• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.

• Extra HEATSINK is required for the LEDs.

Absolute Maximum Ratings at Ta=25?

Item	Symbol	Absolute Maximum Rating	Unit
DC Forward Current	IF	1050	mA
Peak Forward Current	IF	1200	mA
Reverse Voltage	VR	5	V
Power Dissipation	PD	30	W
Electrostatic discharge	ESD	±4500	V
Operation Temperature	Topr	-40~+80	?
Storage Temperature	Tstg	-40~+100	?
Lead Soldering Temperature	Tsol	Max.260? for 6 seconds Max.
Life test	----	1000 H Luminous intensity weaken< 5%(1050mA,Ta=65?); 50,000 H Luminous intensity weaken < 20% (1050mA,Ta=65?);

Electrical Optical Characteristics at Ta=25?

Package Dimensions(mm):

Square Substrate

Oval Substrate

Key Features:

• 99.99% gold wire bonding, 1.2mil

• Red copper Subtrate

• Chips: 20pcs* 45mil Epileds Chips, 10 in series, 2 in parallel. (The chips layout is customizable)

• Substrate Type: Oval and Square

• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.

• Extra HEATSINK is required for the LEDs.

Absolute Maximum Ratings at Ta=25?

Item	Symbol	Absolute Maximum Rating	Unit
DC Forward Current	IF	700	mA
Peak Forward Current	IF	1000	mA
Reverse Voltage	VR	5	V
Power Dissipation	PD	20	W
Electrostatic discharge	ESD	±4500	V
Operation Temperature	Topr	-40~+80	?
Storage Temperature	Tstg	-40~+100	?
Lead Soldering Temperature	Tsol	Max.260? for 6 seconds Max.
Life test	----	1000 H Luminous intensity weaken< 5%(700mA,Ta=65?); 50,000 H Luminous intensity weaken < 20% (700mA,Ta=65?);

Electrical Optical Characteristics at Ta=25?

Package Dimension(mm):

Square Substrate

Round Substrate

Key Features:

• 99.99% gold wire bonding, 1.2mil

• Red copper Substrate

• Chips: 9pcs* 45mil Epileds Chips (3 in series, 3 in parallel)

• Substrate Type: Round and Square

• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.

• Extra HEATSINK is required for the LEDs.

Absolute Maximum Ratings at Ta=25?

Item	Symbol	Absolute Maximum Rating	Unit
DC Forward Current	IF	1050	mA
Peak Forward Current	IF	1200	mA
Reverse Voltage	VR	5	V
Power Dissipation	PD	10	W
Electrostatic discharge	ESD	±4500	V
Operation Temperature	Topr	-40~+80	?
Storage Temperature	Tstg	-40~+100	?
Lead Soldering Temperature	Tsol	Max.260? for 6 seconds Max.
Life test	----	1000 H Luminous intensity weaken< 5%(1050mA,Ta=65?); 50,000 H Luminous intensity weaken < 20% (1050mA,Ta=65?);

Electrical Optical Characteristics at Ta=25?

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Condition
Forward Voltage	VF	8.0	---	9.0	V	If=1050mA
Reverse Current	IR	---	---	50	uA	VR=5V
50% Power Angle	2θ1/2	---	140	---	Deg.	IF=1050mA
Luminous Flux	Φ	600	---	800	lm	IF=1050mA
Peak Wavelength	λp	525	530	535	nm	IF=1050mA

Package Dimension(mm):

Square Substrate

Round Substrate

Key Features:

• 99.99% gold wire bonding, 1.2mil

• Red copper Subtrate

• Chips: 4pcs* 45mil Epileds Chips, 2 in series, 2 in parallel

• Substrate Type: Round and Square

• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.

• Extra HEATSINK is required for the LEDs.

Absolute Maximum Ratings at Ta=25?

Item	Symbol	Absolute Maximum Rating	Unit
DC Forward Current	IF	700	mA
Peak Forward Current	IF	1000	mA
Reverse Voltage	VR	5	V
Power Dissipation	PD	5000	mW
Electrostatic discharge	ESD	±4500	V
Operation Temperature	Topr	-40~+80	?
Storage Temperature	Tstg	-40~+100	?
Lead Soldering Temperature	Tsol	Max.260? for 6 seconds Max.
Life test	----	1000 H Luminous intensity weaken< 5%(700mA,Ta=65?);50,000 H Luminous intensity weaken < 20% (700mA,Ta=65?);

Electrical Optical Characteristics at Ta=25?

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Condition
Forward Voltage	VF	5.0	---	6.0	V	If=700mA
Reverse Current	IR	---	---	50	uA	VR=5V
50% Power Angle	2θ1/2	---	140	---	Deg.	IF=700mA
Luminous Flux	Φ	200	---	300	lm	IF=700mA
Peak Wavelength	λp	525	530	535	nm	IF=700mA