Package Dimension(mm):
Square Substrate
Round Substrate
Key Features:
• 99.99% gold wire bonding, 1.2mil
• Red copper Substrate
• Chips: 4pcs 42mil Epileds (2 in series, 2 in parallel)
• Substrate Type: Round and Square
• Applications: horicultural and algea lighting
• Extra Heatsink is required for the LED.
Absolute Maximum Ratings at Ta=25℃
Item Symbol Absolute Maximum Rating Unit DC Forward Current IF 700 mA Peak Forward Current IF 1000 mA Reverse Voltage VR 5 V Power Dissipation PD 5000 mW Electrostatic discharge ESD ±4500 V Operation Temperature Topr -40~+80 ℃ Storage Temperature Tstg -40~+100 ℃ Lead Soldering Temperature Tsol Max.260℃ for 6 seconds Max. Life test ---- 1000 H Luminous intensity weaken< 5%(700mA,Ta=65℃); 50,000 H Luminous intensity weaken < 20% (700mA,Ta=65℃);
Electrical Optical Characteristics at Ta=25℃
Parameter |
Symbol |
Min. |
Typ. |
Max. |
Unit |
Test Condition |
Forward Voltage |
VF |
4.0 |
--- |
4.5 |
V |
If=700mA |
Reverse Current |
IR |
--- |
--- |
50 |
uA |
VR=5V |
50% Power Angle |
2θ1/2 |
--- |
140 |
--- |
Deg. |
IF=700mA |
Luminous Flux |
Φ |
150 |
--- |
250 |
lm |
IF=700mA |
Peak Wavelength |
λp |
--- |
590 |
595 |
nm |
IF=700mA |
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