Package Dimension(mm):

Key Features:
• 99.99% gold wire bonding, 1.5mil
• Red copper Subtrate
• Chips: 200pcs* 42mil Epileds Chips
• Chips Connections: 20 in series, 10 in parallel (the chips layout is customizable)
• Substrate Type: Oval and Square are available
• Applications: horicultural and algea lighting
• Extra HEATSINK is required for the LEDs.
Specifications:
|
Parameter |
Symbol |
Min. |
Typ. |
Max. |
Unit |
Test Condition |
|
Forward Voltage |
VF |
40.0 |
--- |
44.0 |
V |
If=3500mA |
|
Reverse Current |
IR |
--- |
--- |
50 |
uA |
VR=5V |
|
50% Power Angle |
2θ1/2 |
--- |
140 |
--- |
Deg. |
IF=3500mA |
|
Luminous Flux |
Φ |
8000 |
--- |
9000 |
lm |
IF=3500mA |
|
Peak Wavelength |
λp |
--- |
590 |
595 |
nm |
IF=3500mA |
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