Package Dimension(mm):
Key Features:
• 99.99% gold wire bonding, 1.5mil
• Red copper Substrate
• Chips: 300pcs* 42mil Epileds Chips
• Chips Connections: 20 in series, 15 in parallel (the chips layout is customizable)
• Applications: horicultural and algea lighting
• Extra HEATSINK is required for the LEDs.
Specifications:
Parameter |
Symbol |
Min. |
Typ. |
Max. |
Unit |
Test Condition |
Forward Voltage |
VF |
40.0 |
--- |
44.0 |
V |
If=5250mA |
Reverse Current |
IR |
--- |
--- |
50 |
uA |
VR=5V |
50% Power Angle |
2θ1/2 |
--- |
140 |
--- |
Deg. |
IF=5250mA |
Luminous Flux |
Φ |
10000 |
--- |
12000 |
lm |
IF=5250mA |
Peak Wavelength |
λp |
--- |
590 |
595 |
nm |
IF=5250mA |
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