Package Dimensions(mm):
Square Substrate
Oval Substrate
Key Features:
• 99.99% gold wire bonding, 1.2mil
• Red copper Subtrate
• Chips: 20pcs* 45mil Epileds Chips, 10 in series, 2 in parallel (The chips layout is customizable)
• Substrate Type: Oval and Square
• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.
• Extra HEATSINK is required for the LEDs.
Absolute Maximum Ratings at Ta=25℃
Item |
Symbol |
Absolute Maximum Rating |
Unit |
DC Forward Current |
IF |
700 |
mA |
Peak Forward Current |
IF |
1000 |
mA |
Reverse Voltage |
VR |
5 |
V |
Power Dissipation |
PD |
20 |
W |
Electrostatic discharge |
ESD |
±4500 |
V |
Operation Temperature |
Topr |
-40~+80 |
℃ |
Storage Temperature |
Tstg |
-40~+100 |
℃ |
Lead Soldering Temperature |
Tsol |
Max.260℃ for 6 seconds Max. |
|
Life test |
---- |
1000 H Luminous intensity weaken< 5%(700mA,Ta=65℃); 50,000 H Luminous intensity weaken < 20% (700mA,Ta=65℃); |
Electrical Optical Characteristics at Ta=25℃
Parameter |
Symbol |
Min. |
Typ. |
Max. |
Unit |
Test Condition |
Forward Voltage |
VF |
28.0 |
--- |
30.0 |
V |
If=700mA |
Reverse Current |
IR |
--- |
--- |
50 |
uA |
VR=5V |
50% Power Angle |
2θ1/2 |
--- |
140 |
--- |
Deg. |
IF=700mA |
Luminous Flux |
Φ |
600 |
--- |
800 |
lm |
IF=700mA |
Peak Wavelength |
λp |
495 |
500 |
505 |
nm |
IF=700mA |
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