Package Dimension(mm):
Key Features:
• 99.99% gold wire bonding, 1.5mil
• Red copper Subtrate
• Epileds, 200pcs *45mil Chips
• Chips Layout: 20 in series, 10 in parallel (The layout is customizable)
• Applications: • UV gluing and marking; • UV curing of inks and varnishes; • Fluorescent minerals and gems inspection.
Absolute Maximum Ratings at Ta=25℃
Item |
Symbol |
Absolute Maximum Rating |
Unit |
DC Forward Current |
IF |
3500 |
mA |
Peak Forward Current |
IF |
4000 |
mA |
Reverse Voltage |
VR |
5 |
V |
Power Dissipation |
PD |
200 |
W |
Electrostatic discharge |
ESD |
±4500 |
V |
Operation Temperature |
Topr |
-40~+80 |
℃ |
Storage Temperature |
Tstg |
-40~+100 |
℃ |
Lead Soldering Temperature |
Tsol |
Max.260℃ for 6 seconds Max. |
|
Life test |
---- |
1000 H Luminous intensity weaken< 5%(3500mA,Ta=65℃); 50,000 H Luminous intensity weaken < 20% (3500mA,Ta=65℃); |
Electrical Optical Characteristics at Ta=25℃
Parameter |
Symbol |
Min. |
Typ. |
Max. |
Unit |
Test Condition |
Forward Voltage |
VF |
60.0 |
68.0 |
72.0 |
V |
IF=3500mA |
Reverse Current |
IR |
--- |
--- |
50 |
uA |
VR=5V |
50% Power Angle |
2θ1/2 |
--- |
140 |
--- |
Deg. |
IF=3500mA |
Radiant Power |
Po |
50000 |
--- |
70000 |
mW |
IF=3500mA |
Peak Wavelength |
λp |
--- |
380 |
385 |
nm |
IF=3500mA |
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