Package Dimension(mm):
Key Features:
• 99.99% gold wire bonding, 1.5mil
• Red copper Substrate
• Chips: 200pcs* 45mil Epileds Chips (20 in series, 10 in parallel), the chips layout is customizable
• Substrate Type: Oval
• Applications: Agricultural lighting, horicultural lighting, chemical research and other professional lighting.
• Extra HEATSINK is required for the LEDs.
Specifications:
Parameter |
Symbol |
Min. |
Typ. |
Max. |
Unit |
Test Condition |
Forward Voltage |
VF |
55.0 |
--- |
60.0 |
V |
If=3500mA |
Reverse Current |
IR |
--- |
--- |
50 |
uA |
VR=5V |
50% Power Angle |
2θ1/2 |
--- |
140 |
--- |
Deg. |
IF=3500mA |
Luminous Flux |
Φ |
8000 |
--- |
10000 |
lm |
IF=3500mA |
Peak Wavelength |
λp |
535 |
540 |
545 |
nm |
IF=3500mA |
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